Technology licensing out

Our first in the world technology of atmospheric plasma is ready for scaling up. With Atmospheric Pressure – Plasma Enhanced Chemical Vapour Deposition (AP-PECVD) you can deposit silica like layers on polymeric substrates like PET, PEN and polycarbonate. Our technology platform is characterized by:

• Better performance and more energy efficient than vacuum plasma.
• Protection by over 30 US patents and pending patents.
• High throughput with roll-to-roll process and excellent quality.
• Easy scaling-up for large area coatings.

Our technology opens the door towards a variety of commercial applications. With this in mind Fuji is actively searching for industrial partners for further development and actual manufacturing. We focus on customer oriented tech-transfer to take our technology to the next phase: manufacturing on site. In case of interest don’t hesitate to contact us.