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Fujifilm Athmospheric Plasma

Technology licensing out

Our first in the world technology of atmospheric plasma is ready for scaling up. With Atmospheric Pressure – Plasma Enhanced Chemical Vapour Deposition (AP-PECVD) you can deposit silica like layers on polymeric substrates like PET, PEN and polycarbonate. Our technology platform is characterized by:

  • Better performance and more energy efficient than vacuum plasma.
  • Protection by over 30 US patents and pending patents.
  • High throughput with roll-to-roll process and excellent quality.
  • Easy scaling-up for large area coatings.

Our technology opens the door towards a variety of commercial applications. With this in mind Fuji is actively searching for industrial partners for further development and actual manufacturing. We focus on customer oriented tech-transfer to take our technology to the next phase: manufacturing on site. In case of interest don’t hesitate to contact us.

This Life+ project is supported by the European Commission.
© Fujifilm 2019